High Precision Spectroscopic Ellipsometer | Non-Destructive Thin Film Thickness & Refractive Index Measurement System

This spectroscopic ellipsometer is a high-precision optical metrology system designed for the non-destructive characterization of thin films and bulk materials. Based on advanced ellipsometry principles, it measures polarization state changes (amplitude ratio Ψ and phase difference Δ) to deliver accurate optical constants and structural parameters.


  • Repeatability Measurement Accuracy: 0.005nm
  • Brand: MSK
  • Single Measurement Time: ≤15s
  • Product Detail

    Product Tags

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    Ordering Instructions

    Due to the special nature of the product, the price shown on the page is a deposit price, not the actual price. Please contact customer service for a quote.

    Orders placed directly without prior contact cannot be shipped! Thank you for your cooperation! For more product information, please contact customer service to receive product brochures.

    Key Measurements

    Film Thickness (single to multi-layer)

    Refractive Index (n) & Extinction Coefficient (k)

    Optical Band Gap (Eg)

    Surface Roughness

    Technical Highlights

    Wide Spectral Range: UV to NIR coverage for versatile material analysis

    High Sensitivity: Capable of measuring ultra-thin films down to sub-nanometer scale

    Non-Contact & Non-Destructive: Ideal for sensitive samples in R&D and production environments

    Advanced Modeling Software: Supports complex multi-layer stack analysis with user-friendly workflows

    Applications

    This system is widely adopted in semiconductor manufacturing, optical coating, flat panel displays, photovoltaic (solar cell) development, materials science research, and biosensing.

    Why Choose Our Solution

    As a professional manufacturer with strong R&D capabilities, we offer factory-direct pricing, customizable configurations, and dedicated technical support. Whether you require a benchtop system for laboratory analysis or an in-line solution for production monitoring, we can tailor the instrument to your specific measurement needs.

    Request a Quote

    Contact us today to discuss your application or request a quote. Our team provides complimentary technical consultation to help you select the optimal thin film measurement solution.

    Main Technical Parameters

    1. Measurement Capabilities: 16th order Mueller matrix elements, polarization spectrum Psi/Delta, refractive index, thickness, birefringence, and dielectric constant, etc.

    2. Spectral Range: 210nm-1690nm

    3. Wavelength Spacing: ≤0.8nm@210-1000nm, ≤3.5nm@1000-1690nm

    4. Single-Point Measurement Time: ≤10s

    5. Micro-spot Size: ≤200μm

    6. Modulation Technology: PCSCA dual rotary compensator system modulation

    7. Automatic Sample Stage: Z-axis automatic focusing, maximum travel 18mm, minimum step 1µm

    8. Film thickness repeatability accuracy: ≤0.005nm (100nm SiO2/Si, 30 repeated measurements, calculated as 1σ)

    9. Refractive index repeatability accuracy: ≤0.0002 (100nm SiO2/Si, 30 repeated measurements, calculated as 1σ)

    10. Absolute film thickness accuracy: ≤0.5% (100nm SiO2/Si, third-party metrology report provided)

    11. Mapping function: Employs a high-precision x/y type automatic scanning stage, supports automatic positioning and scanning measurement of 2/4/6/8-inch substrates, repeatability accuracy ≤6μm, one-click generation of 2D/3D film thickness distribution maps

    12. Laser ranging and focusing: Automatic focal length positioning via laser reflection optical path, focusing travel ≤3mm

    13. Difference model: Automatically calculates psi-diff and delta-diff difference data

    14. Analysis software: Features at least 5 different measurement modes, a built-in n/k database for over 100 optical materials, and supports creating custom databases; possesses testing and modeling analysis capabilities for single-layer, multi-layer (up to 30 layers), and composite alternating thin films, including cauchy, Sellmeier, Tauc-Lorentz, Bspline, and Oscillator models, and supports offline software licensing.

    Technical Specifications

    I. Equipment Introduction

    The ME-Mapping Spectroellipsometry features dual-rotation compensator modulation technology combined with high-precision data analysis algorithms. It can acquire all 16 elements of the full Mueller matrix and polarization spectrum in a single measurement, enabling rapid and non-destructive sample measurement. The instrument boasts a stable optical path design and employs a semiconductor-cooled detector, acquiring light intensity signals within seconds. It offers faster measurement speed and higher accuracy, supporting precise measurement of parameters such as thickness, refractive index, extinction coefficient, and optical dielectric constant for various thin film materials. Furthermore, it can be customized with different sized "wafer repeatable positioning stages" for multi-point mapping scanning measurements of various large-sized samples.

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    II. Application Scope

    Ellipsometrists are mainly used in semiconductors, flat panel displays, solar photovoltaics, optical thin films, optical communications, and nanomaterials.

    III. Overall Technical Requirements

    1. Technical Specifications:
    1.1 Measurement Parameters: 16th-order Mueller matrix elements, Psi/Delta, refractive index, thickness, birefringence, and dielectric constant, etc.
    1.2 Spectral Range: 210nm-1690nm;
    1.3 Single-point Measurement Time: ≤10s;
    1.4 Microspot Size: ≤200μm;
    1.5 Modulation Technology: PC1SCA dual rotation compensation modulation;
    1.6 Automatic Sample Stage: Supports automatic z-axis focusing, maximum travel 18mm, minimum step 1μm;
    1.7 Film Thickness Repeatability Accuracy: ≤0.005nm (100nm SiO2/Si, 30 repeated measurements, calculated 1σ);
    1.8 Refractive Index Repeatability Accuracy: ≤0.0002 (100nm SiO2/Si, 30 repeated measurements, calculated 1σ);
    1.9 Absolute Film Thickness Accuracy: ≤0.5% (100nm SiO2/Si, third-party metrology report provided); μm
    1.10 Mapping Function: Employs a high-precision x/y-type automatic scanning stage, supporting automatic positioning and scanning measurement of 2/4/6/8-inch substrates, with a repeatability accuracy ≤6μm, and one-click generation of 2D/3D film thickness distribution maps;
    1.11 Laser Rangefinding and Focusing: Automatically positions the focal length using the laser reflection optical path, with a focus-finding travel ≤3mm;
    1.12 Film Thickness Measurement Range: 1nm-10μm;
    1.13 Difference Model: Automatically calculates psi-diff and delta-diff difference data;
    1.14 Analysis Software:
    * Spectroscopic Measurement Capabilities: 16 elements of the full Mueller matrix, Psi/Delta polarization spectroscopy, N/C/S, depolarization, etc.;
    * Data Analysis Capabilities: Capable of analyzing the thickness and optical constants (n, k) of single-layer and multi-layer (up to 20 layers) isotropic and anisotropic thin film materials;
    * Supports models for optical constants, refractive index gradient distribution, equivalent media, roughness, etc., of multi-component thin films and bulk materials;
    * Supports common optical constant models and common oscillator models (Cauchy model, Lorentz model, Gaussian model, Drude, Sellmeier, etc.), and supports graphical multi-oscillator hybrid model fitting;
    * Supports outputting 2D/3D topographic images, viewing historical data, and exporting and editing data and corresponding reports;
    * Data Output Formats: TXT, CSV, SNAP snapshot, raw spectrum, DAT, etc.;
    * Supports phase delay measurement, capable of testing phase delay, azimuth angle, optical rotation angle, amplitude ratio, order, etc.;
    * Possesses 1D/2D periodic grating structure analysis and modeling functions.

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    2. Configuration List:

    1) One set of ellipsometer main unit;

    2) One set each of ellipsometry arm and analyzer arm;

    3) One set of automatic sample stage;

    4) One set of analysis software;

    5) One set of standard slides;

    6) One computer;

    7) One set of debugging tools;

    8) One set of micro-spot assembly;

    9) One vacuum adsorption pump;

    10) One mapping scanning stage.

    3. Measurement and Control Computer

    Uses a commercial industrial PC with Windows 10 operating system; CPU: i7 processor; Memory: 15GB; Hard Disk: 1TB; LCD monitor: 24-inch; includes mouse and keyboard.

    4. Environmental and Power Requirements:

    1) Platform Requirements: 2.0m (length) x 1.2m (width), load capacity greater than 100kg (optical vibration isolation recommended).
    2) Operating Temperature Range: 20~30°C
    3) Relative Humidity: 35%~60%RH
    4) Power Supply Voltage: 220VAC
    5) Phase Current: RMS value less than 4A (220VAC);
    6) Maximum Power: 800W

    Ellipsometry Measurement Object

    Laboratory Analysis Equipment

    Ellipsometry Measurement Principle

    High Precision Film Measurement

    Ellipsometry Analysis Process

    Used Ellipsometer

    Muller Matrix Ellipsometry

    Wafer Thickness Measurement
    Spectroscopic Ellipsometer for Thin Film

    ME-L Mueller Matrix Ellipsometry

    Research-grade fully automatic high-precision Mueller matrix ellipsometry

    Fully automatic angle adjustment and focusing technology, one-click rapid measurement

    Guided interactive human-machine interface, convenient software operation experience

    Rich material database and algorithm model library, powerful data analysis capabilities

    Technical Specifications

    Model Number ME-L
    Applications Research/Enterprise Grade
    Basic Functions Psi/Delta, R/T, Mueller Matrix, and other optical sensors
    Spectrum Analysis 380-1000nm (supports expansion to 193-2500nm)
    Single Measurement Time ≤15s
    Repeatability Measurement Accuracy 0.005nm
    Absolute Accuracy (Through-through Measurement Air) Ellipsometry parameters: 4 = 45 ± 0.05°, A = 0 ± 0.1°
    Muller matrix: Diagonal element m = 10.005
    Off-diagonal element m = 0 ± 0.005
    Refractive Index Repeatability Accuracy 0.0005
    Spot Size Large spot size: 2-4 mm
    Small spot size: 200 μm/100 μm
    Ultra-small spot size: 50 μm (depending on wavelength)

     

    The repeatability accuracy index is based on 30 repeatable measurements of a 100nm SiO2/Si standard sample;

    The specific technical parameters of the instrument are related to the actual functional modules and accessories, and the data in the table are for reference only.

    Optional Configurations

    Band Selection VN: 380-1650nm
    V: 380-1000nm UN: 210-1650nm
    UV: 245-1000nm DN: 193-1650nm
    UV+: 210-1000nm UN+: 210-2500nm
    DUV: 193-1000nm DN+: 193-2500nm

    Angle Selection

    Fixed: 65°
    Automatic: 45-90°
    Manual: 45-90° (5° increments)

    Other Options

    Mapping Options: 100*100mm/200*200mm

    Temperature Control Stage: 190-550°C/RT-1000°C

    About Us

    微信图片_20230616115337
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    Founded in 2015, MSK (Tianjin) International Trading CO.,Ltd has grown continuously and passed Rheinland ISO 9001 authentication. With German SACCKE high-end five-axis grinding centers, German ZOLLER six-axis tool inspection center, Taiwan PALMARY machine and other international advanced manufacturing equipment, we are committed to producing high-end, professional and efficient CNC tool.
    Our specialty is the design and manufacturing of all kinds of solid carbide cutting tools: End mills, drills, reamers, taps and special tools. Our business philosophy is to provide our customers with comprehensive solutions that improve machining operations, increase productivity, and reduce costs. Service + Quality + Performance. Our Consultancy team also offers production know-how, with a range of physical and digital solutions to help our customers navigate safely into the future of industry 4.0. For more in-depth information on any particular area of our company, please explore our site or use the contact us section to reach out to our team directly.

    Factory Profile

    详情工厂1

    Why Choose Us

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    FAQ

    Q1: Who are we?

    A1: Founded in 2015, MSK (Tianjin) Cutting Technology CO.Ltd has grown continuously and passed Rheinland ISO 9001
    authentication.With German SACCKE high-end five-axis grinding centers, German ZOLLER six-axis tool inspection center, Taiwan PALMARY machine and other international advanced manufacturing equipment, we are committed to producing high-end,professional and efficient CNC tool.

    Q2: Are you trading company or manufacturer?

    A2: We are the factory of carbide tools.

    Q3: Can you send products to our Forwarder in China?

    A3: Yes,if you have Forwarder in China,we will glad to send products to him/her.

    Q4: What terms of payment are acceptable?

    A4: Normally we accept T/T.

    Q5: Do you accept OEM orders?

    A5: Yes, OEM and customization are available, and we also provide label printing service.

    Q6: Why should you choose us?

    A6:1) Cost control - purchasing high-quality products at an appropriate price.

    2) Quick response - within 48 hours, professional personnel will provide you with a quote and address your concerns.

    3) High quality - The company always proves with sincere intention that the products it provides are 100% high-quality.

    4) After sales service and technical guidance - The company provides after-sales service and technical guidance according to customer requirements and needs.


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