Ezweni elisheshayo lokukhiqizwa kwezinto zikagesi, lapho ukunemba kwezinga le-micron kuchaza khona impumelelo, ukwethulwa kwe-Next-Gen PCB Board Drill Bits kuphawula igxathu elikhulu ekwakhiweni kwebhodi lesifunda. Yakhelwe ukubhoboza, ukuqopha, kanye nokwenza i-micromachining kumabhodi esifunda aphrintiwe (ama-PCB) kanye nezinye izinto ezincane kakhulu, lezi Tungsten SteelI-Mini Drill PCBAmathuluzi ahlanganisa izinto zezinga lezindiza nobuchwepheshe bokuzinza kokuzamazama komhlaba ukuze kuchazwe kabusha ukusebenza kahle kanye nokuphila isikhathi eside ekukhiqizweni okuphezulu.
Ubuchwepheshe Bokwenza Izinto Kahle: Kungani Insimbi Ye-Tungsten Ibalulekile
Enhliziyweni yalezi zingcezu zokubhoboza kukhona i-tungsten carbide (WC) emsulwa kakhulu, into ekhethiwe ngenxa yokuhlanganiswa kwayo okungenakuqhathaniswa kobulukhuni (HRA 92), ukumelana nokuguguleka, kanye nokuqina kwesakhiwo. Ngokungafani nokubhoboza okuvamile kwe-HSS (High-Speed Steel), lokhu kwakheka kwensimbi ye-tungsten kunikeza:
Isikhathi Sokuphila Esiyi-3X Eside: Imelana nemijikelezo yokubhoboza engaphezu kuka-15,000 kumabhodi e-fiberglass e-FR-4 ngaphandle kokuwohloka komphetho.
Isakhiwo Sezinhlamvu Ezincane: Izinhlayiya ze-carbide ezingaphansi kuka-0.5µm ziqinisekisa imiphetho yokusika ebukhali njenge-razor, zifinyelela ububanzi bemigodi emincane njengo-0.1mm ngokubekezelelana okungu-±0.005mm.
Umklamo Olwa Nokuqhekeka: I-geometry ye-shank eqinisiwe ivimbela ukuqhekeka ngesikhathi sokusebenza kwe-RPM ephezulu (30,000–60,000), ngisho nasezintweni ze-PCB ezigcwele i-ceramic eziqhekekile.
Ukuhlolwa kweqembu lesithathu yi-Precision Machining Institute of Technology kuqinisekisa ukuthi lawa ma-bits agcina ukuqeda kobuso okungu-Ra 0.8µm ngemuva kwemigodi eyi-10,000 - isici esibalulekile sobuqotho besignali yemvamisa ephezulu kumadivayisi e-5G kanye ne-IoT.
Ukuzinza Kwesimo Sezwe: Ukusika Ngaphandle Kokuyekethisa
Ukubhoboza kwe-PCB kudinga ukuzinza okuphelele ukuze kuvinjelwe "ukuhamba" noma ukungalungi kwemigodi. I-Proprietary Seismic Blade Edge Design ibhekana nalokhu ngale ndlela:
I-Asymmetric Flute Geometry: Ilinganisela ukuphuma kwe-chip kanye nokunciphisa ukudlidliza, inciphisa amandla aseceleni ngo-40%.
I-Nano-Coated Helix Angle: I-30° helix ene-TiAlN coating inciphisa ukwakheka kokushisa (<70°C) ngesikhathi sokusebenza okuqhubekayo.
Ama-Anti-Resonance Grooves: Amashaneli amancane aqoshiwe nge-laser aphazamisa amaza e-harmonic, aqinisekisa ukunemba kwendawo ngaphakathi kwama-5µm kuma-PCB anezingqimba eziyi-10.
Ekuhlolweni kokucindezeleka kokubhoboza imigodi engu-0.3mm ngamabhodi ambozwe nge-aluminium angu-2mm, lawa ma-bits abonise ukuphambuka okungenalutho emijikelezweni engu-500 elandelanayo - into engenakuqhathaniswa nabancintisana nabo.
Izicelo Kuzo Zonke Izimboni
Ama-elekthronikhi Abathengi
Kwabakhiqizi bebhodi lomama le-smartphone:
Ama-Micro-Vias angu-0.2mm: Kufinyelelwe amazinga okukhiqiza angu-99.9% kumabhodi e-HDI anezingqimba ezingu-12.
Amanani Okuphakela Okusheshayo angu-20%: Asebenza ngokunciphisa ukungqubuzana kanye nokuvaleka kwama-chip.
Izimoto zikagesi
Ekukhiqizweni kwemodyuli yamandla e-EV:
Ukuthembeka Kwemigodi Edlulayo: Kugcinwe ukuqhubeka kukagesi okungu-100% ezindaweni ezisebenzisa ukushisa ezinobukhulu obungu-1.6mm.
Ukusebenza Okungenawo Ukupholisa: Amandla okubhoboza okomile agwema ukungcola ezinhlelweni zokuphatha amabhethri ezivaliwe.
Izindiza kanye Nokuvikela
Ukubhoboza imigodi engu-0.15mm kumasekethe e-polyimide flex:
Akukho Kuhlukaniswa Kwemvelo: Ngisho nasezindaweni ezinomswakama ophezulu ezingama-200°C.
Ukuhlela i-EMI Shield: Ukuqopha ngokunemba kwezingqimba zokuvikela ze-RF ezisekelwe ku-graphene.
Imininingwane Yobuchwepheshe
Ububanzi Bebanga: 0.1mm–3.175mm (0.004"–1/8")
Uhlobo lwe-Shank: Ukuhambisana okujwayelekile okungu-3.175mm (1/8") noma i-collet ye-ER yangokwezifiso
Izinketho Zokumboza: I-TiN (igolide), i-TiCN (eluhlaza okwesibhakabhaka), noma i-Diamond-Like Carbon (DLC)
I-RPM Ephezulu: 80,000 (kuncike kububanzi)
Ukuhambisana: Imishini yokubhoboza ye-CNC, imishini yokubhoboza ye-PCB ezenzakalelayo, amathuluzi ajikelezayo aphathwa ngesandla
Ukusetshenziswa Kabusha Kwezindleko
Ukuhlaziywa kwezindleko nezinzuzo okwenziwe ngumenzi we-PCB ohamba phambili waseTaiwan kwembule:
Imali Yokonga Yonyaka engu-$18,500: Ukushintsha ama-drill bit okuncishisiwe (kusukela kumasethi angu-12 kuya kwangu-4 ngonyaka).
Ukunciphisa Amandla okungu-15%: Izidingo eziphansi ze-spindle torque.
Akukho Ukulungiswa: Kususwe u-$220k ngonyaka emabhodini alahliwe avela ekuzulazuleni kwe-drill.
Ukuzinza Okwakhelwe Ngaphakathi
Ukupakisha Okungasetshenziswa Kabusha: Amathreyi e-foam abola ngo-100%.
Ukuhambisana ne-RoHS kanye ne-REACH: Akukho lead, i-cadmium, nezinye izinto eziyingozi.
Impilo Yamathuluzi Enwetshiwe: Ukusetshenziswa kwe-tungsten okuphansi ngo-60% uma kuqhathaniswa nokubhola okujwayelekile.
Ubufakazi Bomsebenzisi
"Ukushintshela kulezi zingcezu zensimbi ye-tungsten kwaba ushintsho," kusho uHiroshi Tanaka, uMphathi Wokukhiqiza kumkhiqizi wezinzwa oseKyoto. "Sibhoboza imigodi engu-20,000 ngokushintsha ngakunye ngaphandle kokushintsha kwamathuluzi - into engacabangeki ngama-drill ethu amadala e-HSS. Umklamo wokuzamazama komhlaba wodwa unciphisa ukwenqatshwa kwethu kwemigodi ngo-95%.
Kungani Kufanele Ukhethe Lezi Zingcezu Zokubhoboza Ibhodi Le-PCB?
Ukunemba Okungaphuki: Kokunemba okufana ne-laser kumabhodi e-high-density interconnect (HDI).
Isivinini Esingenalo Uzinikelo: Bhoboza imigodi engu-0.3mm emigodini engu-400 ngomzuzu ngaphandle kokwehlisa ikhwalithi yomphetho.
Ukuhambisana Okubanzi: Kusebenza ne-FR-4, i-Rogers, i-aluminium, ngisho nama-laminate aqiniswe ngengilazi.
Umklamo Oqinisekisa Ikusasa: Ulungele izinto ze-PCB zesizukulwane esilandelayo njenge-dielectric ezingenayo i-halogen kanye ne-ultra-low-loss.
Isiphetho
Embonini lapho yonke i-micron inquma khona inzuzo kanye nokusebenza kahle, lezi Tungsten SteelAmabhithi Okubhoboza Ibhodi le-PCBzingaphezu nje kwamathuluzi – ziyinzuzo yamasu. Ngokuhlanganisa isayensi yezinto ezibonakalayo nobunjiniyela bokuzinza, zinika amandla abakhiqizi ukuthi badlule imingcele ye-miniaturization ngenkathi benciphisa
Isikhathi sokuthunyelwe: Mashi-21-2025
