Pasi pehuwandu hwekusashanda kwenguva refu kwezvigadzirwa zvemagetsi zvepasi rose uye huwandu hwakawanda hwezvigadzirwa zvemagetsi zvepasi rose, tekinoroji yekugadzira bhodhi remadunhu akadhindwa (PCB) iri kutarisana nematambudziko asina kumboitika ekunyatsoita zvinhu nemazvo. Kuti igutse kudiwa uku, MSK (Tianjin) International Trading CO., Ltd ichangobva kutanga chizvarwa chitsva chehunyanzvi hwepamusoro-soro.zvidimbu zvekuboorera zvebhodhi redunhu rakadhindwanhevedzano, kutsanangura patsva mwero wekushanda kwezvishandiso zvekuboorera nemazvo nesainzi yezvinhu zvitsva uye dhizaini yezvivakwa.
Yakagadzirwa nesimbi ye tungsten yakaoma zvikuru, ichiputsa muganho wekugara kwenguva refu
Iyi nhevedzano yemabhora edhiringi yakagadzirwa nesimbi ye tungsten yemhando yendege, uye chimiro chekristaro chinosimbiswa kuburikidza ne nano-level sintering process, kuitira kuti chigadzirwa chive nekuomarara kwakanyanya uye kusimba kwacho. Inoderedza zvakananga mutengo wekutsiva maturusi evagadziri ne30%, kunyanya yakakodzera nzvimbo dzakadai se5G communication modules uye automotive electronics dzinoda multi-layer high-density kuburikidza nemaburi.
Dhizaini yemhando yeblade inodzivirira kudedera ine simba, kunyatsojeka kusvika padanho re micron
Mukupindura dambudziko rekuzununguka mukugadzirwa kwemaburi madiki-diki ari pasi pe0.2mm, timu yeR&D yakagadzira girovhosi respiral gradient blade groove nenzira itsva. Kuburikidza nechimiro chejometri chakagadziriswa ne fluid dynamics simulation, kushushikana kwekucheka kunoparadzirwa zvinobudirira, uye amplitude yekuzununguka kwekugadzirisa inoderedzwa kusvika 1/5 yeavhareji yeindasitiri. Miedzo chaiyo inoratidza kuti mukugadzirwa kwedhayamita yegomba re0.1mm, kutsauka kwenzvimbo yegomba kunodzorwa zvakadzikama mukati me ±5μm, uye kuomarara kwepadenga Ra≤0.8μm, iyo inosangana zvizere nezvinodiwa zve submount (SLP) neIC submount.
Kuwedzera kwekushandiswa kwezviitiko zvakawanda
Pamusoro pekushandiswa kukuru kwePCB, nhevedzano iyi yezvidzidzo yakasimbiswa muminda yemidziyo yekurapa, michina yemaziso, nezvimwewo:
Inogona kugadzirisa maburi ekupisa kwe micro heat e ceramic substrates nemazvo (senge aluminium nitride)
Pinda pasina kupwanya pamapepa esimbi isina ngura ane ukobvu hwe0.3mm
Inoshandiswa pakunyora mifananidzo ye3D kudhinda mu micro-channel
Kuti zvienderane nehukuru hwakasiyana hwezvinhu, mutsetse wechigadzirwa unopa makona matatu emakona e30°, 45°, uye 60°, uye unosanganisira saizi yakazara ye0.05-3.175mm.
Nguva yekutumira: Kurume-05-2025
