Nyob rau hauv lub nthwv dej ntawm kev txuas mus ntxiv miniaturization thiab siab ceev ntawm cov khoom siv hluav taws xob thoob ntiaj teb, luam tawm Circuit Board (PCB) kev tsim khoom siv tshuab tau ntsib cov teeb meem tsis tau pom dua. Yuav kom ua tau raws li qhov kev thov no, MSK (Tianjin) International Trading CO., Ltd tsis ntev los no tau tsim lub cim tshiab ntawm kev ua haujlwm siab.printed circuit board laum khoomseries, redefining cov qauv kev ua tau zoo ntawm precision drilling cov cuab yeej nrog cov khoom siv tshiab science thiab cov qauv tsim.
Ua los ntawm ultra-hard tungsten steel, rhuav tshem qhov kev txwv ntawm kev ua haujlwm ntev
Cov cuab yeej siv no yog ua los ntawm aviation-qib tungsten steel, thiab cov qauv siv lead ua muaj zog los ntawm nano-theem sintering txheej txheem, kom cov khoom muaj ob qho tib si ultra-siab hardness thiab toughness tshuav nyiaj li cas. Nws ncaj qha txo cov cuab yeej hloov pauv ntawm cov tuam txhab tsim khoom los ntawm 30%, tshwj xeeb tshaj yog tsim rau cov xwm txheej xws li 5G kev sib txuas lus modules thiab cov khoom siv hluav taws xob tsheb uas xav tau ntau txheej txheej high-density los ntawm qhov.
Dynamic anti-vibration hniav qauv tsim, precision mus txog micron qib
Hauv kev teb rau qhov teeb meem kev vibration hauv ultra-micro qhov ua hauv qab 0.2mm, R & D pab pawg tau tsim kho tshiab ntawm kauv gradient hniav zawj qauv. Los ntawm cov duab geometric optimized los ntawm cov kua dej dynamics simulation, txiav kev ntxhov siab yog dispersed zoo, thiab cov kev vibration amplitude yog txo mus rau 1/5 ntawm kev lag luam nruab nrab. Cov kev ntsuam xyuas tiag tiag qhia tau hais tias nyob rau hauv kev ua ntawm 0.1 hli lub qhov taub, lub qhov sib txawv ntawm qhov chaw yog ruaj khov nyob rau hauv ± 5μm, thiab qhov chaw roughness Ra≤0.8μm, uas ua tau raws li qhov yuav tsum tau nruj me ntsis ntawm submount (SLP) thiab IC submount.
Multi-scenario thov expansion
Ntxiv nrog rau cov ntawv thov tseem ceeb ntawm PCB, cov kev xyaum ua haujlwm no tau raug txheeb xyuas hauv cov khoom siv kho mob, cov khoom siv kho qhov muag, thiab lwm yam:
Nws tuaj yeem ua cov txheej txheem micro kub dissipation qhov ntawm ceramic substrates (xws li txhuas nitride)
Ua tiav kev nkag mus tsis muaj burr ntawm 0.3mm tuab stainless hlau los xij
Siv rau micro-channel engraving ntawm 3D luam ntawv pwm
Txhawm rau hloov mus rau cov khoom sib txawv, cov khoom lag luam muab peb lub kaum sab xis ntawm 30 °, 45 °, thiab 60 °, thiab npog tag nrho qhov loj me ntawm 0.05-3.175mm.
Post lub sij hawm: Mar-05-2025
