I loko o ke ao wikiwiki o ka hana ʻana i nā mea uila, kahi e wehewehe ai ka pololei o ka pae micron i ka holomua, ʻo ka hoʻolauna ʻana o Next-Gen PCB Board Drill Bits e hōʻailona ana i kahi lele quantum i ka hana ʻana o ka papa kaapuni. Hana ʻia no ka ʻeli ʻana, ka kahakaha ʻana, a me ka micromachining ma nā papa kaapuni i paʻi ʻia (PCB) a me nā substrates ultra-thin ʻē aʻe, ʻo kēia mau Tungsten SteelPCB wili liʻiliʻiHoʻohui nā mea hana i nā mea hana aerospace me ka ʻenehana paʻa seismic e wehewehe hou i ka pono a me ke ola lōʻihi i ka hana nui.
ʻO ka ʻEnekinia Maikaʻi: No ke aha he mea nui ai ke kila Tungsten
Ma ka puʻuwai o kēia mau ʻāpana wili e waiho ana i ka tungsten carbide maʻemaʻe kiʻekiʻe (WC), kahi mea i koho ʻia no kona hui ʻana o ka paʻakikī (HRA 92), ke kūpaʻa ʻana i ka ʻaʻahu, a me ke kūpaʻa o ke kūkulu ʻana. ʻAʻole e like me nā wili HSS (High-Speed Steel) maʻamau, hāʻawi kēia ʻano kila tungsten i:
3X Longer Lifespan: Kū i nā pōʻaiapuni wili he 15,000+ ma nā papa fiberglass FR-4 me ka ʻole o ka hōʻino ʻana o ka lihi.
ʻAno Micro-Grain: Hōʻoia nā ʻano carbide sub-0.5µm i nā lihi ʻoki ʻoi loa, e hoʻokō ana i nā anawaena lua e like me 0.1mm me ka hoʻomanawanui ±0.005mm.
Hoʻolālā Anti-Fracture: ʻO ke ʻano shank i hoʻoikaika ʻia e pale aku i ka haki ʻana i ka wā o nā hana RPM kiʻekiʻe (30,000–60,000), ʻoiai i nā mea PCB i hoʻopiha ʻia me ka seramika palupalu.
Ua hōʻoia ka hoʻāʻo ʻana o ka ʻaoʻao ʻekolu e ka Precision Machining Institute of Technology e mālama kēia mau ʻāpana i ka hoʻopau ʻana o ka ʻili Ra 0.8µm ma hope o 10,000 mau lua - he mea koʻikoʻi no ka pono o ka hōʻailona alapine kiʻekiʻe ma nā polokalamu 5G a me IoT.
Paʻa o ka Seismic: ʻOki me ka ʻole o ka hoʻokuʻikahi
Pono ka ʻeli ʻana o ka PCB i ke kūpaʻa piha e pale aku i ka "hele wāwae" a i ʻole ka hewa o ka lua. Hoʻoponopono ka Proprietary Seismic Blade Edge Design i kēia ma o:
ʻO ke ʻano o ka ʻohe ʻole: Hoʻoponopono i ka hoʻoneʻe ʻana o nā ʻāpana a me ka damping haʻalulu, e hōʻemi ana i nā ikaika ʻaoʻao e 40%.
ʻO ke kihi Helix Nano-Coated: ʻO kahi helix 30° me ka uhi ʻana o TiAlN e hōʻemi i ka hōʻiliʻili ʻana o ka wela (<70°C) i ka wā o ka hana mau.
Nā Grooves Anti-Resonance: Hoʻopilikia nā micro-channels i hoʻopaʻa ʻia e ka laser i nā alapine harmonic, e hōʻoiaʻiʻo ana i ka pololei o ke kūlana i loko o 5µm ma nā PCB 10-layer.
Ma kahi hoʻāʻo koʻikoʻi i ka ʻeli ʻana i nā lua 0.3mm ma o nā papa alumini 2mm, ua hōʻike kēia mau ʻāpana i ka ʻokoʻa ʻole ma luna o 500 mau pōʻaiapuni i hoʻomau ʻia - kahi hana i hoʻohālikelike ʻole ʻia e nā mea hoʻokūkū.
Nā noi ma nā ʻoihana like ʻole
Nā Uila Mea kūʻai aku
No nā mea hana motherboard kelepona akamai:
0.2mm Micro-Vias: Ua hoʻokō i ka 99.9% o nā uku ma nā papa HDI 12-papa.
20% Nā helu hānai wikiwiki: Hoʻāla ʻia e ka hoʻemi ʻana i ka friction a me ka paʻa ʻana o nā ʻāpana.
Nā ʻElekole Kaʻa
I ka hana ʻana o ka modula mana EV:
Hilinaʻi ma o ka puka: Mālama ʻia ka hoʻomau uila 100% i loko o nā substrates conductive thermal 1.6mm ka mānoanoa.
Hana ʻAʻohe Coolant: Pale ka hiki ke wili maloʻo i ka haumia i loko o nā ʻōnaehana hoʻokele pila paʻa.
Aerospace & Pale Kaua
Ke ʻeli ʻana i nā lua 0.15mm i nā kaapuni polyimide flex:
ʻAʻohe Delamination: ʻOiai ma nā wahi haʻahaʻa kiʻekiʻe he 200°C.
Ke ʻano pale EMI: Ke kaha kiʻi pololei no nā papa pale RF e pili ana i ka graphene.
Nā Kikoʻī ʻenehana
Ka laulā o ke anawaena: 0.1mm–3.175mm (0.004"–1/8")
ʻAno Shank: Maʻamau 3.175mm (1/8") a i ʻole ka hoʻohālikelike ʻana o ka collet ER maʻamau
Nā Koho Uhi: TiN (gula), TiCN (polū), a i ʻole Diamond-Like Carbon (DLC)
Max RPM: 80,000 (e hilinaʻi ana i ke anawaena)
Hoʻohālikelike: Nā mīkini wili CNC, nā mīkini paʻi wili PCB automated, nā mea hana wili lima
Hoʻākāka Hou ʻia ka Pono o ke Kumukūʻai
Ua hōʻike ʻia kahi loiloi kumukūʻai-pōmaikaʻi e kahi mea hana PCB Taiwanese alakaʻi:
$18,500 Mālama Makahiki: Hoʻemi ʻia nā pani ʻana o nā ʻūlili wili (mai 12 a 4 mau seti/makahiki).
15% Hoʻemi Ikehu: Nā koi torque spindle haʻahaʻa.
ʻAʻohe Hana Hou: Ua hoʻopau ʻia he $220k/makahiki ma nā papa i ʻoki ʻia mai ka wili ʻauwaha.
Hoʻomau i kūkulu ʻia
Pūʻolo hana hou: nā pā huʻa palaho 100%.
Hoʻokō ʻana iā RoHS & REACH: ʻAʻohe ona kēpau, cadmium, a me nā mea weliweli ʻē aʻe.
Ola Mea Hana i Hoʻolōʻihi ʻia: 60% haʻahaʻa o ka hoʻohana ʻana i ka tungsten ma mua o nā wili maʻamau.
Nā Hōʻike Manaʻo o ka Mea Hoʻohana
"He mea hoʻololi nui ka hoʻololi ʻana i kēia mau ʻāpana kila tungsten," wahi a Hiroshi Tanaka, Luna Hoʻokele Hana ma kahi mea hana sensor ma Kyoto. "Ke ʻeli nei mākou i 20,000 mau lua i kēlā me kēia neʻe ʻana me ka ʻole o ka hoʻololi ʻana i nā mea hana - kahi mea hiki ʻole ke noʻonoʻo ʻia me kā mākou mau ʻeli HSS kahiko. ʻO ka hoʻolālā seismic wale nō i hōʻemi i kā mākou mau hōʻole ʻana i ke kūlana lua ma 95%.
No ke aha e koho ai i kēia mau ʻāpana wili papa PCB?
Precision Unbreakable: No ka pololei e like me ka laser i nā papa interconnect high-density (HDI).
Māmā me ka ʻOle o ka Mōhai: E wili i nā lua 0.3mm ma 400 mau lua/minuke me ka ʻole o ka hoʻohaʻahaʻa ʻana i ka maikaʻi o ka lihi.
Hoʻohālikelike Honua: Hana pū me FR-4, Rogers, alumini, a me nā laminates i hoʻoikaika ʻia i ke aniani.
Hoʻolālā Hōʻoia i ka Wā E Hiki Mai Ana: Mākaukau no nā mea PCB hanauna hou e like me nā dielectrics halogen-free a me nā ultra-low-loss.
Hopena
Ma kahi ʻoihana kahi e kuhikuhi ai kēlā me kēia micron i ka pono a me ka hana, ʻo kēia mau kila TungstenNā ʻāpana wili papa PCBʻoi aku ma mua o nā mea hana - he pono koʻikoʻi lākou. Ma ka hoʻohui ʻana i ka ʻepekema mea me ka ʻenekinia paʻa, hoʻoikaika lākou i nā mea hana e hoʻokuke i nā palena o ka miniaturization ʻoiai e ʻoki ana
Ka manawa hoʻouna: Malaki-21-2025
